MediaTek And HFCL Join Hands To Help Telcos Address Last-Mile 5G Connectivity

The 5G FWA Indoor CPE from HFCL boasts features such as an ultra-compact design and low power consumption, courtesy of the MediaTek T750 chipset.

With a 2.5 Gbps Ethernet interface facilitating high-speed data transfer, the HFCL 5G solution comes equipped with an integrated eSIM.

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In a bid to support the government's goal of establishing a sustainable telecom ecosystem, HFCL Limited, a technology enterprise and communications solution provider, announced a partnership with chip-maker MediaTek. This collaboration aims to integrate MediaTek's chipset with indoor 5G solutions, assisting telecom operators in overcoming last-mile connectivity obstacles.

The 5G FWA Indoor CPE from HFCL boasts features such as an ultra-compact design and low power consumption, courtesy of the MediaTek T750 chipset.

During the ongoing Mobile World Congress (MWC) 2024 event in Barcelona, Spain, the company stated that the 7nm compact chipset is furnished with a 5G radio and quad-core Arm CPU, guaranteeing smooth connectivity across various devices with dual-band 4x4 Wi-Fi 6 support.

“The HFCL 5G FWA Indoor CPE helps telecom operators address the last-mile connectivity challenges in an ultra-compact form factor and provides a fibre-like experience to both consumers and enterprises,” Mahendra Nahata, Managing Director, HFCL, said in a statement.

With a 2.5 Gbps Ethernet interface facilitating high-speed data transfer, the HFCL 5G solution comes equipped with an integrated eSIM.

According to the company, it's a plug-and-play device accompanied by an AI-integrated mobile app, facilitating easy self-installation and assisting users in identifying the optimal signal location.

“This partnership is another endeavour to support the Indian government’s vision of creating a sustainable telecom ecosystem by promoting local manufacturing,” said Evan Su, General Manager, Wireless Communications, MediaTek.

“Our modem propels their vision by offering full functionality, enabling device makers to create high-performance CPE products in the smallest, yet the most efficient form factors,” Evan noted.

According to industry estimates, the global 5G last-mile equipment market is projected to reach $68 billion by 2030.