iPhone 13 Lineup's Stock May Not Meet Demand Until February 2022. Here's Why

Apple's components shortage are is beginning to ease slowly as production increases, but iPhone 13 line's shortage will remain until February 2022.

iPhone 13 Lineup Stock May Not Meet Demand Until February 2022

New Delhi: Apple's components shortage are is beginning to ease slowly as production increases and that also means the iPhone maker will be able to manufacture handsets speedily. According to a report in DigiTimes, the IC components crisis emerging in early October for the new iPhone 13 series is gradually easing, but the new lineup's stock won't be able to match the demand until February 2022. 

Apple, due to its have cash reserves, has managed to wade through the global chipset crisis even as other smartphone makers have been feeling the pinch. However, the global shortage of chips is such that  even as TSMC has reserved many of its production lines for Apple's chipsets, a bunch of legacy chipsets are falling short of demand and that prevents the devices from being built. 

Earlier, Apple CEO Tim Cook mentioned that the components crisis cost the iPhone maker $6 billion last quarter and the number is expected to grow in the last quarter of the year as well. 

Meanwhile, the Cupertino-based iPhone maker has cut the production of the iPad by 50 per cent in the past two months in the wake of the supply crunch of chipsets globally. The iPhone maker is slashing production of the iPads to feed components to the newly launched iPhone 13, a report said earlier last week.

According to a report in Nikkei Asia, Apple tends to give priority to the production of iPhone over the iPad since the former has been a top revenue driver for the Cupertino, California-based company.

All brands globally are staring at chip shortage which has been fueled by the ongoing Coronavirus pandemic that has also impacted supply chains.

Several components used in manufacturing of the iPhone and iPad are common, thus, giving Apple the liberty to shift supplies between devices in some cases. The common components include both peripheral and core chips.