Google Pixel 9 Series Leaks: Specifications & Benchmark Results Revealed Tensor G4

It's important to remember that these devices are not running final software, and there are still months of optimisation and tuning ahead hence, one should take this information with a pinch of salt.

The FOWLP (Fan-out Wafer Level Packaging) technique is reported to continue enhancing heat management and power efficiency. ( Image Source :Google )

After being photographed, the leaked Pixel 9, 9 Pro, and 9 Pro XL have now been tested with early benchmarks. Additionally, new information about the Tensor G4 has come out. According to benchmark results from Rozetked, the Tensor G4 has a 1+3+4 core setup, with the Cortex-X4 as the main core. It also includes three Cortex-A720 cores and four smaller Cortex-A520 cores. In comparison, the original Tensor and Tensor G2 had a 2+2+4 core setup, while the Tensor G3 used a 1+4+4 configuration. Here's a comparison of these setups:

The Cortex-X4, also used by the Snapdragon 8 Gen 3, is claimed by Arm to be 15 per cent faster and 40 per cent more power-efficient than the previous version. The Cortex-A720 offers a 20% increase in power efficiency compared to its predecessor, and the Cortex-A520 shows a 22 per cent improvement.

It's important to remember that these devices are not running final software, and there are still months of optimisation and tuning ahead. Keep this in mind when looking at the AnTuTu benchmark results for the Tensor G4 on the Pixel 9 series. Even with these early benchmarks, some performance improvements can already be seen. The Pixel 8 is included in the benchmarks for comparison, further highlighting the significant improvements in the Pixel 9 series over its predecessor. These early results suggest promising enhancements for users eagerly anticipating the new models.

Google Pixel 9, 9 Pro, 9 Pro XL Vs Google Pixel 8

Pixel 8: 877,443 points
Pixel 9 (Tokay): 1,016,167
Pixel 9 Pro (Caiman): 1,148,452
Pixel 9 Pro XL (Komodo): 1,176,410

With the Tensor G5 in the Pixel 10 expected to switch to TSMC, the Pixel 9 and its Samsung-made chip might come with a significant caveat for buyers this year. Earlier leaks indicated that the Tensor G4 would utilise Samsung’s latest 4nm process and packaging method. The FOWLP (Fan-out Wafer Level Packaging) technique is reported to continue enhancing heat management and power efficiency.