In a bid to support the government's goal of establishing a sustainable telecom ecosystem, HFCL Limited, a technology enterprise and communications solution provider, announced a partnership with chip-maker MediaTek. This collaboration aims to integrate MediaTek's chipset with indoor 5G solutions, assisting telecom operators in overcoming last-mile connectivity obstacles.


The 5G FWA Indoor CPE from HFCL boasts features such as an ultra-compact design and low power consumption, courtesy of the MediaTek T750 chipset.


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During the ongoing Mobile World Congress (MWC) 2024 event in Barcelona, Spain, the company stated that the 7nm compact chipset is furnished with a 5G radio and quad-core Arm CPU, guaranteeing smooth connectivity across various devices with dual-band 4x4 Wi-Fi 6 support.


“The HFCL 5G FWA Indoor CPE helps telecom operators address the last-mile connectivity challenges in an ultra-compact form factor and provides a fibre-like experience to both consumers and enterprises,” Mahendra Nahata, Managing Director, HFCL, said in a statement.


With a 2.5 Gbps Ethernet interface facilitating high-speed data transfer, the HFCL 5G solution comes equipped with an integrated eSIM.


According to the company, it's a plug-and-play device accompanied by an AI-integrated mobile app, facilitating easy self-installation and assisting users in identifying the optimal signal location.


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“This partnership is another endeavour to support the Indian government’s vision of creating a sustainable telecom ecosystem by promoting local manufacturing,” said Evan Su, General Manager, Wireless Communications, MediaTek.


“Our modem propels their vision by offering full functionality, enabling device makers to create high-performance CPE products in the smallest, yet the most efficient form factors,” Evan noted.


According to industry estimates, the global 5G last-mile equipment market is projected to reach $68 billion by 2030.