Chipset manufacturers Intel Corporation and Broadcom Inc. have showcased the industry’s first cross-vendor Wi-Fi 7 demonstration, with over-the-air speeds of more than 5Gbps. The trial used an Intel Core processor-based laptop with a Wi-Fi 7 solution connected to a Broadcom Wi-Fi 7 access point.
The demonstration was meant to show that two silicon makers have readied the hardware to go for Wi-Fi 7 and how new wireless network technology brings improvement over the current generation Wi-Fi 6.
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Wi-Fi 7 is the platform for the next 10 years of wireless experiences, which require higher speeds, lower latency, improved reliability and greater capacity. Wi-Fi 7 leverages new features including wider 320 MHz channels in unlicensed 6GHz spectrum, higher order 4K QAM data modulation, simultaneous connections across multiple bands with multi-link operation and improved channel utilisation efficiency with multi-resource unit puncturing.
“We are proud to highlight how next-generation Wi-Fi 7 can make new mobile PC experiences possible. Industry collaboration is essential to ensure we deliver on the promises of this new wireless technology. We would like to thank our colleagues at Broadcom for their great technical cooperation, which helped enable this unprecedented, first-of-its-kind demonstration of ultra-high speed and ultra-low latency Wi-Fi 7,” Carlos Cordeiro, Intel Fellow and Wireless CTO, Client Computing Group, Intel, said in a statement.
“Today’s milestone sends a clear message: the ecosystem is ready and Wi-Fi 7 is here to deliver extraordinary capacity and blazing fast speeds to extend gigabit broadband. The reliable, low latency communication provided by Wi-Fi 7 is a key element of Broadcom's vision for connecting everything as the Internet evolves to its next iteration replete with immersive experiences," said Vijay Nagarajan, Vice President, Wireless Connectivity Division, Broadcom.